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Low profile DIP switches, SMT or through-hole

产品特色

Low profile
• The lowest case available in 2, 4, 6 and 8 pole versions
• Reduction of the shadow effect in IR soldering
• 30 % reduction of component volume

2 VERSIONS
Surface mount models
• Designed for reflow soldering
• UL 94-V0 high temperature materials
• Tin plated terminals
Through-hole models
• Same thermal specifications as SMT models, allowing mixed soldering process

Washable by construction
• Process compatible - withstand IR reflow soldering
• Moulded-in terminals
• Ultrasonic-welded case
• Two slots on case corners allowing removal of protection tape

Reliable contacts
• Anti-crush system on moving contact
• Bifurcated self-cleaning sliding contacts
• Positive detent actuation
• Recessed slide actuators with positive detent preventing accidental actuation
• Good visibility of actuators : black slide on clear background

2 TYPES OF PACKAGING
Surface mount models
• Tape and reel (1.000 pieces per reel) - IC tubes
Through-hole models
• IC tubes

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